Led package and fabrication method thereof

ABSTRACT

An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of U.S. application Ser. No.11/416,107 filed May 3, 2006; which claims priority under 35 U.S.C.§119(a) of Korean Patent Application No. 2005-72261, filed Aug. 8, 2005;the entire contents of the prior applications are hereby incorporatedtherein by reference.

BACKGROUND OF THE INVENTION

1. Field of the invention

Methods and apparatuses consistent with the present invention relate toa package of a light emitting diode (LED) used for generally backlightunits of liquid crystal displays (LCD) and lightings and a fabricationmethod thereof.

2. Description of the Related Art

Since LEDs have many advantages such as a long life span and low powerconsumption, they are being used in a variety of fields includingelectronics and advertising. Recently, there have been attempts to useLEDs as backlight units in LCD devices, and it is expected that the useof LEDs in indoor and outdoor lighting systems will become wide spread.There is an increasing demand for LED packages with a small size andwhich can efficiently dissipate heat.

LEDs used in backlight units for LCDs or in lighting apparatuses requirehigh power consumption. However, when the temperature rises, theperformance of LEDs exponentially decays. Therefore, thermal managementof LED packages is important.

FIG. 1 illustrates a cross-sectional view of a conventional LED package.As illustrated in FIG. 1, the LED package includes an LED 1, a heat sinkmember 2 on which the LED 1 is disposed, leads 3 and 3′, wires 4 and 4′for electrically connecting the LED 1 to the leads 3 and 3′, and a body5 for enclosing the heat sink member 2 and the leads 3 and 3′ therein.

The heat sink member 2 is exposed on the bottom surface thereof and iscovered with an insulating layer 6 on the top surface thereof. The LED 1is bonded at the center portion of the insulating layer 6 by an adhesive7 and first ends of each of the leads 3 and 3′ are arranged on the sidesof the insulation layer 6. The second ends of the leads 3 and 3′ projectfrom the sides of the body 5 and are exposed. The wires 4 and 4′ connectthe LED 1 to the first ends of the leads 3 and 3′. A cap (not shown) canbe disposed on the top of the body 5 for sealing the LED 1.

The conventional LED package as described above is mounted on a board 10such that the second ends of the leads 3 and 3′ are soldered to pads 11and 11′, respectively, provided on the board 10. Further, since solder12 is disposed between the heat sink member 2 of the LED package and theboard 10, heat generated by the LED 1 can be released via the heat sinkmember 2, the solder 12 and the board 10.

However, conventional LED packages, such as shown in FIG. 1, have longheat transfer paths (e.g: LED→insulating layer→heat sinkingmember→solder→board). Further, since the heat transfer path includesmany different materials, the heat sinking capability decreases due toan increase in thermal resistance. Accordingly, a conventional LEDpackage such as described above is not suitable for high power LEDs.

Thermal resistance Rth is expressed by the following equation:Rth=L/(k*A). According to this equation, the thermal resistance Rthdecreases as thickness becomes smaller, that is, the heat transfer pathL becomes shorter, and the heat transmittance k and the heat sinkingarea A become larger. However, since a conventional LED has contactsformed between different materials and the heat transfer path L is long,thermal resistance is high in a conventional LED package.

When heat dissipation performance of an LED package is not good, thelife span of the LED may be reduced and fatal damage may be caused tothe system employing the LED package because the peripheral parts of thesystem may deteriorated or be thermally deformed.

Further, since the parts of a conventional LED package (e.g. the packagebody, the leads, and the pads) are formed separately, a method offabricating the LED package and the structure of the LED package arecomplicated.

SUMMARY OF THE INVENTION

According to one exemplary embodiment of the present invention, there isprovided an LED package including an upper metal plate having anLED-receiving hole, and a lower metal plate mounted to a lower surfaceof the upper metal plate via an insulator disposed therebetween. Aportion of the lower metal plate is exposed via the LED-receiving holein the upper metal plate. An LED is mounted on the exposed portion ofthe lower metal plate and electrically connected to the upper and lowermetal plates A protective cover encloses and protects exposed surfacesof the upper and lower metal plates.

A lead extends from at least one of the upper metal plate and the lowermetal plate, and the lead forms an integrated single body with the metalplate from which it extends.

The lead may extend and project through the protective cover.

The LED package may further include a lens mounted on the upper metalplate.

In the LED package, a lens attachment unit may be provided on theprotective cover.

The upper and lower metal plates may be made of aluminum (Al) or copper(Cu).

In the LED package, an inner circumference of the LED receiving hole maybecome larger from the lower surface to an upper surface of the uppermetal plate, and a reflective coating layer may be formed on an innercircumferential surface of the LED receiving hole.

The insulator may have a penetration hole therein in a positioncorresponding to the position of the LED receiving hole. The insulatormay be an adhesive insulator which adheres the upper and lower metalplates together.

The insulator may comprise a polymer film.

The insulator may be made of a plastic material.

The insulator may be formed by injecting a plastic mold material into agap between the upper and lower metal plates.

The insulator and the protective cover may be formed as an integratedsingle body.

The insulator and the protective cover may be formed by a plasticmolding method.

The LED may be electrically connected to the lower metal plate by solderand electrically connected to the upper metal plate by a wire.

The LED may be coupled to the lower metal plate by bonding and may beelectrically connected to the upper metal plate and the lower metalplate by conductive wires.

The LED package above may further include a sub-mount, wherein the submount is mounted on the exposed portion of the lower metal plate and theLED is mounted on the sub-mount. The sub-mount has a first electrode anda second electrode which are connected to the LED by solder and furtherelectrically connected to the lower and upper metal plates, respectivelyby conductive wires.

According to another exemplary embodiment of the present invention,there is provided a method of fabricating an LED package, including:providing an upper metal plate having an LED receiving hole therein; andproviding a lower metal plate. An inner circumferential surface of theLED-receiving hole is reflective. The method further includes: affixingthe upper and lower metal plates to each other via an insulation layer;mounting an LED on the lower metal plate; electrically connecting theLED to the upper and lower metal plates; enclosing the upper and lowermetal plates with a protective cover; and installing a lens over theLED.

The upper metal plate may have a first lead which extends therefrom andwhich is integrated into a single body together with the upper metalplate.

The lower metal plate may have a second lead which extends therefrom andwhich is integrated into a single body together with the lower metalplate.

The upper metal plate and the lower metal plate may be formed byinjection-molding a metal material.

The step of affixing the plates via an insulation layer may includepreparing an insulating adhesive, having a hole therein in a positioncorresponding to the position of the LED receiving hole, placing theinsulating adhesive between the lower metal plate and the upper metalplate; and tightly adhering the lower and upper metal plates to eachother.

The insulating adhesive may comprise an adhesive polymer.

The protective cover may be formed by plastic extruding, and the lensmay be formed by plastic extruding.

The protective cover and the lens may be formed in an integrated singlebody by plastic extruding.

According to another exemplary embodiment of the present invention,there is provided a method for fabricating an LED package, includingproviding an upper metal plate having an LED-receiving hole andproviding a lower metal plate. An inner circumferential surface of theLED-receiving hole is reflective. The method further comprises affixingthe upper metal plate to the lower metal plate such that the upper andthe lower metal plates are insulated from each other and such that theexteriors of the two metal plates are insulated from the outside;mounting an LED on the lower metal plate; electrically connecting theLed to the upper and lower metal plates; and installing a lens over theLED.

The upper metal plate may have a first lead extending therefrom andforming an integrated single body therewith.

The lower metal plate may have a second lead extending therefrom andforming an integrated single body therewith.

The upper and the lower metal plates may be formed by injection-moldinga metal material.

The step of affixing the upper metal plate to the lower metal plate mayinclude positioning the upper and lower metal plates to face each otherwith a gap therebetween; filling the gap between the upper and lowermetal plates with an insulating material; and enclosing the upper andlower metal plates with an insulating material, thereby forming aprotective cover.

The steps of filling the gap with insulating material and enclosing theupper and lower metal plates may be simultaneously performed by aplastic molding process.

The protective cover may have a lens attachment unit to which the lensis mounted.

According to another exemplary embodiment of the present invention,there is provided a method for fabricating an LED package, including:providing a plurality of upper metal plates, each having an LEDreceiving hole therein, in an upper substrate made of a metal material;providing a plurality of lower metal plates in a lower substrate made ofa metal material; adhering the upper metal plates to corresponding lowermetal plates such that the plurality of upper metal plates are insulatedfrom the plurality of lower metal plates; mounting a plurality of LEDson the lower metal plates such that each LED is electrically connectedto an upper metal plate and to a lower metal plates; enclosing the upperand lower metal plates with a protective cover; and installing aplurality of lenses over the LEDs. The upper and lower substrates may becut such that the portions of the upper and lower substrates connectingthe upper and lower metal plates are cut, thereby forming a plurality ofLED packages.

Each of the plurality of upper metal plates may include a lead extendingtherefrom and forming an integrated single body therewith. Each of theplurality of lower metal plates may include a lead extending therefromand forming an integrated single body therewith.

The step of adhering the upper metal plates to the lower metal platesmay include preparing an insulator having a shape corresponding to thatof the upper and lower metal plates and having a hole therein at aposition corresponding to the position of the LED receiving hole;disposing the insulator between the upper and lower substrates; andpressing the upper and lower metal plates, thereby adhering them to eachother.

The step of enclosing the upper and lower metal plates may includeforming the protective cover by plastic extruding, and forming the lensby plastic extruding.

The protective cover and the lens may be simultaneously formed as anintegrated single body.

According to another exemplary embodiment of the present invention,there is provided a method for fabricating an LED package, including:providing a plurality of upper metal plates, each having an LEDreceiving hole therein, in an upper substrate made of a metal material;providing a plurality of lower metal plates in a lower substrate made ofa metal material and providing them under the upper metal plates;affixing the upper metal plates to corresponding lower metal plates;insulating the upper metal plates from the lower metal plates;insulating the exposed portions of the upper and lower metal plates fromthe outside; mounting a plurality of LEDs on the lower metal plates suchthat each LED is electrically connected to an upper metal plate and to alower metal plates; installing a plurality of lenses over the LEDs; andcutting parts the upper and lower substrates thereby forming a pluralityof LED packages.

Each of the plurality of upper metal plates may include a lead extendingtherefrom and forming an integrated single body therewith. Each of theplurality of lower metal plates may include a lead extending therefromand forming an integrated single body therewith.

The step of affixing the upper metal plates to the lower metal platesmay include positioning the upper metal plates and the lower metalplates to face each other with a gap there between; filling the gap withan insulating material; and enclosing the upper and lower metal plates,thereby forming a protective cover.

The steps of filling the gap and enclosing the upper and lower metalplates may be simultaneously performed by plastic molding.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other exemplary aspects and of the present invention willbecome more apparent from the following detailed description ofexemplary embodiments thereof with reference to the attached drawingfigures, wherein;

FIG. 1 is a cross-sectional view of a conventional LED package;

FIG. 2 is a perspective view of an LED package according to a firstexemplary embodiment of the present invention;

FIG. 3 is a cross-sectional view taken along line II-II shown in FIG. 2;

FIG. 4A is a perspective view of an upper metal plate shown in FIG. 3;

FIG. 4B is a perspective view of a lower metal plate shown in FIG. 3;

FIG. 5A to FIG. 5D are schematic views of a fabrication method of theLED package according to the first exemplary embodiment of the presentinvention;

FIG. 6 is an exploded perspective view of an LED package according to asecond exemplary embodiment of the present invention;

FIG. 7 is a cross-sectional view taken along line VII-VII shown in FIG.6;

FIG. 8A to FIG. 8C are schematic views of a fabrication method of theLED package shown in FIG. 6 and FIG. 7;

FIG. 9 is a cross-sectional view of an LED package according to a thirdexemplary embodiment of the present invention;

FIG. 10 is a cross-sectional view of an LED package according to afourth exemplary embodiment of the present invention;

FIG. 11 is a cross-sectional view of an LED package according to a fifthexemplary embodiment of the present invention; and

FIG. 12 is a cross-sectional view of an LED package according to a sixthexemplary embodiment of the present invention.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS OF THE INVENTION

Hereinafter, LED packages according to exemplary embodiments of thepresent invention will be described in detail with reference to theaccompanying drawing figures. In explaining the embodiments of thepresent invention, detailed descriptions of related known functions andconfigurations will be omitted.

Referring to FIG. 2 and FIG. 3, an LED package 100 according to thefirst exemplary embodiment of the present invention includes an uppermetal plate 110, a lower metal plate 120, an insulator 130 disposedbetween the upper metal plate 110 and the lower metal plate 120, an LED140, and a protective cover 150.

The upper metal plate 110 has a thin film structure made of a metalmaterial such as aluminum (Al) or copper (Cu). As illustrated in FIG.4A, the upper metal plate 110 has a body 111 with a plate-like shape anda first lead 112 extending from a side of the body 111. The first lead112 and the body 111 are a single piece with a predetermined length. Thefirst lead 112 can bent into a curve shape by external force. When theLED package is installed on a board, the first lead 112 can beelectrically connected to an electrode pad provided on the board.

The upper metal plate 110 also has an LED-receiving hole 113 throughwhich an LED 140 can be installed. The LED receiving-hole 113 penetratesthe body 111 of the upper metal plate 110 and its inner circumferentiallength increases from a lower surface to an upper surface of the uppermetal plate 110. A coating layer 115 made of a metal may be coated onthe inner circumferential surface of the LED receiving-hole 113 toenhance the light reflectance. The coating layer 115 may be formed byplating silver (Ag) or Nickel.

The lower metal plate 120 is attached to the upper metal substrate 110via the insulator 130 disposed therebetween. The shape of the lowermetal plate 120 corresponds to that of the upper metal plate 110.Referring to FIG. 4B, the lower metal plate 120 includes a body 121 anda second lead 122 extending from a side of the body 121. The lower metalplate 120 has an LED support 123 which projects upward from the uppersurface thereof and is located at a position corresponding to theLED-receiving hole 113 of the upper metal plate 110. The LED 140 ismounted on the LED support 123.

The lower metal plate 120 is made of the same material as the uppermetal plate 110. When the LED package 100 is mounted on a board, thesecond lead 122, like the first lead 112, is connected to an electrodepad formed on the board.

The insulator 130 is disposed between the upper and lower metal plates110 and 120 for insulating them from each other. The insulator 130 maybe an adherent polymer film. The insulator 130 has a hole 131 therein,in a position corresponding to that of the LED-receiving hole 113 sothat the LED support 123 of the lower metal plate 120 is exposed throughthe LED receiving-hole 113.

The LED 140 is electrically bonded to the surface of the LED support 123via solder 141 and is electrically connected to the upper metal plate110 via a conductive wire 143.

The protective cover 150 encapsulates the exterior of the upper andlower metal plates 110 and 120. The protective cover 150 may be formedby plastic-molding such that it encloses the upper and lower metalplates 110 and 120 but does not enclose the first and second leads 112and 122. The bottom surface of the lower metal plate 120 is not coveredby the protective layer 150. The bottom of the lower metal plate 120 canbe directly bonded to a board and can be electrically connected toelectrode pads provided on the board.

The LED 140 is covered by a lens 160 to guide light emitted from the LED140 in a predetermined direction. The lens 160 may be made of a plasticmaterial and can be formed by a molding method in an integrated singlebody together with the protective layer 150.

In an LED package 100 having the configuration described above, sincethe LED 140 is directly in contact with the lower metal plate 120, heatgenerated in the LED 140 can be efficiently transferred to the lowermetal plate 120. Also, since the lower metal plate 120 is thin andbroad, thermal resistance is reduced due to the large heat-sink area,and thus the heat dissipation performance is enhanced.

Further, since the upper and lower metal plates 110 and 120 serve aselectrodes of the LED 140, additional electrodes are not needed. As aresult, the LED package has a simple structure. Accordingly, fabricationprocesses and assembling processes of the LED package are simplified.Because the metal plates 110 and the first lead 112 and the mental plate120 and the second lead 122 are formed as integrated bodies,respectively, the number of parts of the LED package is reduced and thusthe fabrication and the assembly of the LED package are simplified.

Since the upper metal plate 110 is made of metal, the surface of itsbody 111 can function as a light reflection layer. Accordingly, it ispossible to enhance the light reflectance.

Hereinafter, a method for fabricating an LED package according to thefirst embodiment of the present invention will be described. Alarge-volume fabrication method of the LED package 100 is exemplified inthis embodiment.

First, as illustrated in FIG. 5A, a plurality of upper metal plates 110are formed by processing an upper metal substrate 20. The number ofupper metal plates 110 formed by one metal substrate 20 may bepredetermined. The upper metal plates 110 are coupled to a connectionpart 21 of the metal substrate 20 by the portions of the upper metalplates 110 which will later become the leads 112. Later, the connectionparts 21 may be removed by cutting. The upper metal plates 110 may beformed by injection-molding.

Next, referring to FIG. 5B, a plurality of lower metal plates 120 isformed by processing a lower substrate 30. The plurality of lower metalplates correspond to the plurality of upper metal plates 110 in positionand size. The lower substrate 30 is also made of metal and may be formedby injection-molding. The lower metal plates 120 can be coupled toconnection parts 31 of the lower substrate 30 by the leads 122. Thenumber and positions of the upper metal plates 110 provided by the uppersubstrate 20 are identical to those of the lower metal plates 120 madefrom the lower substrate 30.

Next, as shown in FIG. 5C, the substrates 20 and 30 are positioned toface each other, and an insulating film 40, serving as the insulator130, is disposed between the substrates 20 and 30. In order to constructa substrate assembly in which an insulating film 40 is sandwiched by thesubstrates 20 and 30, the insulating film 40 may first be adhered ontothe lower substrate 30, then the upper substrate 20 may be disposed ontothe insulating film 40, and then the stacked structure may be pressed.As a result, as shown in FIG. 5D, a substrate assembly 50, in which twosubstrates 20 and 30 are combined, is prepared.

After preparation of the substrate assembly 50, the LEDs 140 are mountedon the corresponding lower metal plates 120, such that the LEDs 140 areelectrically connected to corresponding upper metal plates 110 and thelower metal plates 120 which face each other. That is, referring to FIG.3, each LED 140 is connected to a corresponding lower metal plate 110via a piece of solder 141 and is connected to a corresponding uppermetal plate 110 via a wire 143.

Next, as illustrated in FIG. 5D, the exterior of the package is enclosedby the protective cover 150 and the lens 160, which are formed byplastic extruding. As a result, the exterior of the LED package ismolded by a plastic mold and is insulated from the outside. The lens 160and the protective cover 150 are formed as an integrated single body.Accordingly, the upper metal plate 110 and the lower metal plate 120 aresecurely combined.

Finally, the connection parts 21 and 31 and the leads 112 and 122, whichare exposed to the outside of the protective cover 150, are cut, andthus a plurality of LED packages, as shown in FIG. 2 and FIG. 3, isproduced.

Referring to FIG. 6 and FIG. 7, an LED package 200 according to thesecond exemplary embodiment of the present invention includes an uppermetal plate 110, a lower metal plate 120, an LED 140, an insulator 230,for insulating the upper metal plate 110 and the lower metal plate 120from each other, a protective cover 250, and a lens 260, for enclosingthe exterior of the upper and lower metal plates 110 and 120.

In explaining elements of the LED package 200 according to the secondexemplary embodiment illustrated in FIG. 6 and FIG. 7, like elements inthe LED package 100 and the LED package 200 are denoted by likereference numerals and will not be described repeatedly.

The insulator 230 is made of a plastic material and is formed byinjecting a plastic molding material between the upper metal plate 110and the lower metal plate 120.

The protective cover 250 is also formed by the plastic molding used toform the insulator 230 and has a lens attachment unit 251 for receivingthe lens 260 thereon. The protective cover 250 and the insulator 230 maybe formed by plastic molding as an integrated single body. The lens 260is bonded on the lens attachment unit 251 by an adhesive. Epoxy resincan be applied on the surface of the lens attachment unit 251 to sealthe gap between the lens 260 and the protective cover 250.

A method of fabricating the LED package 200 according to the secondexemplary embodiment of the present invention will be described below.

First, as stated above with reference to FIG. 5A and FIG. 5B, uppermetal plates 110 and lower metal plates 120 are formed by processing anupper substrate 20 and a lower substrate 30, respectively.

Next, as illustrated in FIG. 8A, the upper substrate 20 and the lowersubstrate 30 are positioned to face to each other and are combined, sothat a substrate assembly 50 is formed. At this time, unlike in themethod described with reference to FIG. 5C, an insulator, i.e. a polymerfilm, is not interposed between the substrates 20 and 30. Rather, whenthe substrate assembly 50 is prepared, as illustrated in FIG. 8B, a gapG of a predetermined size is left between the upper metal plates 110 andthe lower metal plates 120. Then, the gap G is filled with a plasticmaterial when the exterior of the upper and lower metal plates 110 and120 are encapsulated by a plastic molding method. As a result, as shownin FIG. 8C, the insulator 230 and the protective cover 250 areintegrated into a single body. As described above, if the insulator 230and the protective cover 250 are formed simultaneously as an integratedsingle body, the LED package fabrication time can be reduced and abonding force between the upper metal plate 110 and the lower metalplate 120 is enhanced.

Next, via the LED receiving hole 113, an LED 140 is mounted on a part ofthe lower metal plate which is not covered by the protective cover 250.Then, a lens 260 is attached on a lens attachment unit 251 of theprotective cover 250 and the packaging process of the LED package 20.

Predetermined portions of the substrate assembly 50 are cut out and thusthe LED packages 200, with first and second leads 112 and 122 exposed tothe outside of the protective cover 250, are produced in large volumesas illustrated in FIG. 6 and FIG. 7.

According to the first and second exemplary embodiments of the presentinvention, in the LED packages 100 and 200 in which the LED 140 isdirectly and electrically connected to the lower metal plate 120 viasolder 141 and connected to the upper metal plate 110 by a wire 143,only the vertical type of LEDs are exemplified. However, other types ofLEDs can also be packaged according to the methods of the presentinvention.

As illustrated in FIG. 9, an LED package 300, employing a lateral typeof LED 340, can be realized by a method of the present invention. Inthis case, the LED 340 is bonded to the lower metal plate 120 by solder341 and is connected to the metal plates 110 and 120 by conductive wires342 and 343. In FIG. 9, like elements which are the same as in the LEDpackage 200 described with reference to FIG. 6 and FIG. 7 are denoted bylike reference numerals, and thus detailed description on like elementsof the LED package 300 will be omitted. Reference numeral 60 designatesa board on which the LED package 300 is mounted. Since a lower metalplate 120 is closely adhered to the board 60, heat transfer andradiation effects are enhanced. Further, leads 112 and 122 of metalplates 110 and 120, respectively, are electrically connected toelectrode pads (not shown) provided on the surface of the board 60.

As illustrated in FIG. 10, an LED 440 may be a flip-chip type in whichelectrodes are provided on the bottom surface thereof. In this case, asub-mount 450 is provided on the part of the lower metal plate 120 whichis exposed through the LED receiving hole 113. This sub-mount 450 has afirst electrode 451 and a second electrode 452, which are insulated fromeach other, on one surface thereof. Accordingly, the LED 440 connectedto the first and second electrodes 451 and 452 is bonded by a firstsolder 441 and a second solder 442. The first and second electrodes 451and 452 are electrically connected to the upper and lower metal plates110 and 120 by wires 443 and 444, respectively.

In the above-described embodiment, the structure in which the upper andlower metal plates 110 and 120 are formed as integrated bodies with theleads 112 and 122, respectively, is merely exemplary. That is, a lead orleads can be provided to either or both of the upper metal plate 110 andthe lower metal plate 120. As illustrated in FIG. 11, a lead 112 may beprovided to only the upper metal plate 110 and may project through theprotective cover 150. That is, it is possible that a lead is notprovided to the lower metal plate 520. In this case, when LED package500 is mounted on a board 60, the lead 112 of the upper metal layer 110is electrically connected, via solder, to a first electrode pad 61provided on the board 60. The lower metal plate 530 can be electricallyconnected to a second electrode pad 62 provided on the board 60 viasolder 72. That is, since the lower metal plate 520 is directly andelectrically connected to the second electrode pad 62 on the board 60,the LED package can have a simple structure and thus its assembly issimplified. Since the heat of the lower metal plate 520 is transferredvia the solder 72 and the second electrode pad 62, heat transferefficiency and heat dissipation performance are enhanced.

Referring to FIG. 12, in the structure in which an upper metal plate 610and a lower metal plate 620 are insulated from each other by aninsulator 130, the bottom surface of the upper metal plate 610 can bedirectly connected to the first electrode pad 61 of the board 60 via asolder bump 81. It is also possible that the bottom surface of the lowermetal plate 620 is electrically connected to the second electrode pad 62of the board 60 by solder 82. According to the structure above, theupper metal plate 610 and the lower metal plate 620 can be directly andelectrically connected to the electrode pads 61 and 62 respectively,while the upper metal plate 610 and the lower metal plate 620 areseparated by the insulator 130, without using leads. Accordingly, suchstructure is advantageous in that it has a simple configuration andincludes a smaller number of parts compared to conventional structures.Accordingly, the fabrication process is simplified, production cost isreduced, and productivity is increased.

As described above, according to a fabrication method of the presentinvention, an LED package having enhanced heat dissipation performanceand a thin, small structure can be produced. Consequently, it is easy toimplement a high power LED package used as a backlight unit of an LCD orin lighting systems.

The total thickness of an LED package can be reduced by forming an uppermetal plate and a lower metal plate, serving as electrodes, separated byan insulator, thereby enhancing the heat sinking efficiency.

Further, since upper and lower metal plates serve as electrodes of anLED, additional electrodes are not needed. As a result, fabricationprocesses and assembling processes of an LED package are simplified.

While the invention has been shown and described with reference toexemplary embodiments thereof, it will be understood by those skilled inthe art that various changes in form and details may be made thereinwithout departing from the spirit and scope of the invention as definedby the appended claims.

1. A light emitting diode (LED) package, comprising: an upper metalplate having an LED-receiving hole; a lower metal plate combined mountedto a lower surface of the upper metal plate via an insulator disposedtherebetween, wherein a portion of the lower metal plate is exposed viathe LED-receiving hole in the upper metal plate; an LED mounted on theexposed portion of the lower metal plate and electrically connected tothe upper and lower metal plates; and a protective cover disposed on theupper metal plate, wherein the lower metal plate has an LED supportwhich projects upward from the upper surface thereof and which islocated on the exposed portion thereof.
 2. The package of claim 1,wherein at least one of the upper metal plate and the lower metal plateincludes a lead extending from a side thereof; wherein the lead forms anintegrated single body together with the corresponding metal plate. 3.The package of claim 1, further comprising: solder, which electricallyconnects the LED to the lower metal plate, and a wire, whichelectrically connects the LED to the upper metal plate.
 4. The packageof claim 1, further comprising a lens mounted on the upper metal plate,wherein the protective cover includes a lens attachment unit, and thelens is bonded on the lens attachment unit by an adhesive.
 5. Thepackage of claim 4, wherein an epoxy resin is applied on the lensattachment unit to seal the gap between the lens and the protectivecover.
 6. The package of claim 1, wherein the LED comprises a lateraltype LED.
 7. The package of claim 6, wherein the LED is bonded to thelower metal plate by a solder and is connected to the upper and lowermetal plates by conductive wires.
 8. The package of claim 7, wherein theupper and lower metal plates comprises leads, respectively.
 9. Thepackage of claim 1, wherein the LED comprises a flip-chip type LED inwhich electrodes are provided on the bottom surface thereof.
 10. Thepackage of claim 9, wherein the LED package further comprises asub-mount which is disposed on the LED support, and the LED is mount onthe sub-mount.
 11. The package of claim 10, wherein the sub-mountcomprises a first electrode and a second electrode which are soldered tothe LED, and wherein the first electrode is connected to the upper metalplate via at least one first wire and the second electrode is connectedto the lower metal plate via at least one second wire.
 12. The packageof claim 1, wherein the protective cover encloses exposed surfaces ofthe upper and lower metal plates, wherein a lead is provided to eitherthe upper metal plate or the lower metal plate and the lead projectsthrough the protect cover.
 13. An apparatus comprising: a light emittingdiode (LED) package; and a board on which the LED package is mounted,wherein the LED package comprises: an upper metal plate having anLED-receiving hole; a lower metal plate combined mounted to a lowersurface of the upper metal plate via an insulator disposed therebetween,wherein a portion of the lower metal plate is exposed via theLED-receiving hole in the upper metal plate; an LED mounted on theexposed portion of the lower metal plate and electrically connected tothe upper and lower metal plates; and a protective cover disposed on theupper metal plate, and wherein the lower metal plate has an LED supportwhich projects upward from the upper surface thereof and which islocated on the exposed portion thereof.
 14. The apparatus of claim 13,wherein at least one of the upper metal plate and the lower metal plateincludes a lead extending from a side thereof; wherein the lead forms anintegrated single body together with the corresponding metal plate. 15.The apparatus of claim 14, wherein the board has electrode pads providedthereto, and wherein the lead of the at least one of the upper metalplate and the lower metal plate is connected to the correspondingelectrode pad.
 16. The apparatus of claim 13, wherein the lower metalplate is directly disposed on the board.
 17. The apparatus of claim 13,wherein the protective cover encloses exposed surfaces of the upper andlower metal plates, and wherein a lead is provided to either the uppermetal plate or the lower metal plate and the lead projects through theprotect cover.
 18. The apparatus of claim 17, wherein the lead isprovided to only the upper metal plate and the lead of the upper metallayer is electrically connected to a first electrode pad provided on theboard, and the lower metal plate can be electrically connected to asecond electrode pad provided on the board.
 19. The apparatus of claim13, wherein a bottom surface of the upper metal plate is directlyconnected to a first electrode pad of the board via a solder bump. 20.The apparatus of claim 19, wherein the bottom surface of the lower metalplate is electrically connected to a second electrode pad of the boardby a solder.